The SPD750 chip grinding machine is suitable for wafer and chip packaging processing. It features micron-level thickness control, a production capacity of 100-200kg per hour, and supports customized specifications. It meets DIN66399 E7 standards, operates stably and is easy to operate, and is compatible with various types of semiconductor processing. Read More

The SPD200 chip grinding machine is suitable for 2-8 inch chip wafers, with ultra-thin grinding of 25μm and a tolerance of ±2μm. It features a rigid dual-axis CNC structure, dust-free sealing, and can operate for 24 hours. It is compatible with various types of chip grinding, with precision comparable to imported products and high cost performance. Read More

The SPD150 high-precision chip grinding machine features high processing accuracy, controllable particle size, a production capacity of 5KG per hour, a stable body that meets safety standards, and is easy to operate. It is suitable for both sample testing and mass production. Read More

The SPD300 chip grinding machine is suitable for 6-12 inch wafers, with a thickness control accuracy of ±2μm. It features excellent processing quality and strong production capacity. The structure is stable and easy to operate, meeting high-level safety standards, taking into account R&D and mass production, and facilitating the precise production of semiconductors. Read More