The SPD200 chip grinding machine is suitable for 2-8 inch chip wafers, with ultra-thin grinding of 25μm and a tolerance of ±2μm. It features a rigid dual-axis CNC structure, dust-free sealing, and can operate for 24 hours. It is compatible with various types of chip grinding, with precision comparable to imported products and high cost performance. Read More

The SPD150 high-precision chip grinding machine features high processing accuracy, controllable particle size, a production capacity of 5KG per hour, a stable body that meets safety standards, and is easy to operate. It is suitable for both sample testing and mass production. Read More

The SPD750 chip grinding machine is compatible with various types of wafer chips, featuring micron-level thickness control, outstanding production capacity, stable operation with low noise, reaching E7 safety level, easy operation and maintenance, and is suitable for precision processing of all kinds of semiconductors. Read More

The SPD150 compact chip grinder is suitable for materials such as wafers, chips, and certificates. It has a precision of ±2μm, a production capacity of 5KG per hour, controllable particle size, and complies with the DIN66399 high safety standard. It is small and easy to use, suitable for multiple scenarios. Read More