The HD200 small industrial demagnetizer weighs 23kg. It features a stainless steel body with pure copper coils and is suitable for demagnetizing storage media and metal workpieces. 12,500 oE strong magnetic field, 20-second single-piece processing, 360 pieces per working hour, with intelligent heat dissipation, capable of continuous operation. Read More

The SPD750 chip grinding machine is suitable for wafer and chip packaging processing. It features micron-level thickness control, a production capacity of 100-200kg per hour, and supports customized specifications. It meets DIN66399 E7 standards, operates stably and is easy to operate, and is compatible with various types of semiconductor processing. Read More

The SPD350 chip grinding machine is suitable for 2-8 inch wafers, with a production capacity of 80kg/h and a precision of ±2μm. It is digitally controlled and intelligent, reaching DIN66399 E7 grade. It combines R&D and mass production and is suitable for the precision grinding of various semiconductor chips. Read More

The SPD300 is compatible with 6-12 inch wafers, with ±2μm thickness control and a surface Ra≤0.01μm. It is highly efficient for mass production and suitable for laboratory use. The rigid body is equipped with a numerical control closed-loop system, ensuring safety and compliance, stable precision, and outstanding cost performance. Read More

The SPD200 chip grinding machine is suitable for 2-8 inch chip wafers, with ultra-thin grinding of 25μm and a tolerance of ±2μm. It features a rigid dual-axis CNC structure, dust-free sealing, and can operate for 24 hours. It is compatible with various types of chip grinding, with precision comparable to imported products and high cost performance. Read More

The SPD150 high-precision chip grinding machine features high processing accuracy, controllable particle size, a production capacity of 5KG per hour, a stable body that meets safety standards, and is easy to operate. It is suitable for both sample testing and mass production. Read More