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The SPD150 is a high-precision compact chip-specific grinding machine, suitable for small and medium-sized wafers within 100mm and various semiconductor chips. It can also handle hard materials such as SSD/ memory chips, CD/DVD discs, ID cards, and credit cards, meeting the needs of both small-scale laboratory trial production and mid-range large-scale production. The equipment is equipped with a closed-loop control system for flatness, and comes standard with 4mm thickened grinding blades. The grinding thickness accuracy reaches ±2μm, and the surface roughness Ra is less than 100nm, with top-notch processing accuracy. It can process 5 kilograms of material per hour, and the particle size of the finished product can be controlled within 0.2 to 5 millimeters, with stable processing efficiency. The whole machine adopts reinforced steel structure, operates shockproof without deviation, and strictly complies with DIN 66399 standard E-6/O-6/F-5/T-7 safety level. Equipped with an intelligent control panel, the parameters are adjustable and easy to operate. The compact body is suitable for multiple scenarios. It is a cost-effective preferred device for semiconductor precision grinding and fine material processing.
